Findchips: Compare 5962-3865001BCX vs 74HC00D,652

5962-3865001BCX vs 74HC00D,652 feature comparison

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Source Content uid	5962-3865001BCX	74HC00D,652
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	NATIONAL SEMICONDUCTOR CORP	NXP SEMICONDUCTORS
Package Description	DIP,	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-GDIP-T14	R-PDSO-G14
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Propagation Delay (tpd)	21 ns	135 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Position	DUAL	DUAL
Base Number Matches	1	2
Rohs Code		Yes
Part Package Code		SOIC
Pin Count		14
Manufacturer Package Code		SOT108-1
ECCN Code		EAR99
Samacsys Manufacturer		NXP
JESD-609 Code		e4
Length		8.65 mm
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		SOP14,.25
Packing Method		TUBE
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		27 ns
Schmitt Trigger		NO
Seated Height-Max		1.75 mm
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		1.27 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		3.9 mm
	Logic » Gates	Logic » Gates