5962-7802001MFA
vs
AM26LS32B/BFA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| JESD-30 Code |
R-XDFP-F16
|
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Low Current-Max |
0.008 A
|
|
| Package Body Material |
CERAMIC
|
|
| Package Code |
DFP
|
|
| Package Equivalence Code |
FL16,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK
|
|
| Qualification Status |
Not Qualified
|
|
| Receive Delay-Max |
38 ns
|
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Supply Current-Max |
70 mA
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
TTL
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - hot dipped
|
|
| Terminal Form |
FLAT
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
9
|
2
|
| Package Description |
|
,
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|