5962-8403701CX vs 74HC132DB,118 feature comparison

5962-8403701CX Intersil Corporation

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74HC132DB,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code DIP SSOP1
Package Description DIP, SOT-337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT337-1
JESD-609 Code e4
Length 6.2 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 38 ns
Propagation Delay (tpd) 38 ns
Schmitt Trigger YES
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HC132DB,118 with alternatives