5962-8606101EA vs MC74HC157AN feature comparison

5962-8606101EA Harris Semiconductor

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MC74HC157AN onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR ONSEMI
Package Description FRIT SEALED, CERDIP-16 PLASTIC, DIP-16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 190 ns 160 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.44 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Rohs Code No
Part Package Code DIP
Pin Count 16
ECCN Code EAR99
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Length 19.175 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Package Equivalence Code DIP16,.3
Packing Method RAIL
Peak Reflow Temperature (Cel) 235
Prop. Delay@Nom-Sup 32 ns
Time@Peak Reflow Temperature-Max (s) 30

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