5962-8681801RA vs MM74HC688MTCX feature comparison

5962-8681801RA Texas Instruments

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MM74HC688MTCX Rochester Electronics LLC

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Pbfree Code Yes Yes
Rohs Code No Yes
Part Life Cycle Code Active Contact Manufacturer
Ihs Manufacturer TEXAS INSTRUMENTS INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP TSSOP
Package Description DIP, DIP20,.3 4.40 MM, MO-153, TSSOP-20
Pin Count 20 20
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T20 R-PDSO-G20
JESD-609 Code e0 e3
Length 24.195 mm 6.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type IDENTITY COMPARATOR MAGNITUDE COMPARATOR
Max I(ol) 0.0052 A
Number of Bits 8 8
Number of Functions 8 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 313 ns 220 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 4.4 mm
Base Number Matches 1 1
Additional Feature CASCADABLE
Moisture Sensitivity Level 1

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