Findchips: Compare 5962-8683101CA vs 74HC132DB,118

5962-8683101CA vs 74HC132DB,118 feature comparison

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Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	DEFENSE LOGISTICS AGENCY	NXP SEMICONDUCTORS
Part Package Code	DIP	SSOP1
Package Description	DIP,	SSOP, SSOP14,.3
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HCT	HC/UH
JESD-609 Code	e0	e4
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SSOP
Package Style	IN-LINE	SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)	135 ns	38 ns
Qualification Status	Qualified	Not Qualified
Seated Height-Max	5.08 mm	2 mm
Supply Voltage-Max (Vsup)	5.5 V	6 V
Supply Voltage-Min (Vsup)	4.5 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Finish	TIN LEAD	NICKEL PALLADIUM GOLD
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	5.3 mm
Base Number Matches	6	2
Source Content uid		74HC132DB,118
Rohs Code		Yes
Manufacturer Package Code		SOT337-1
JESD-30 Code		R-PDSO-G14
Length		6.2 mm
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Number of Terminals		14
Package Equivalence Code		SSOP14,.3
Package Shape		RECTANGULAR
Packing Method		TAPE AND REEL
Peak Reflow Temperature (Cel)		260
Power Supplies		2/6 V
Prop. Delay@Nom-Sup		38 ns
Schmitt Trigger		YES
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates