5962-8683101CA vs 74HC132PW,112 feature comparison

5962-8683101CA Intersil Corporation

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74HC132PW,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Part Package Code DIP TSSOP
Package Description DIP, SOT-402-1, TSSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 4850.05 62.85
CO2e (mg) 60140.616 779.34
Family HCT HC/UH
JESD-609 Code e0 e4
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 4.4 mm
Base Number Matches 4 2
Rohs Code Yes
Manufacturer Package Code SOT402-1
JESD-30 Code R-PDSO-G14
Length 5 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Terminals 14
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 31 ns
Propagation Delay (tpd) 38 ns
Schmitt Trigger YES
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HC132PW,112 with alternatives