5962-8683101CA vs TC74HC132AFN-ELP feature comparison

5962-8683101CA Intersil Corporation

Buy Now

TC74HC132AFN-ELP Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP TOSHIBA CORP
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 4850.05 151.15
CO2e (mg) 60140.616 1874.26
Family HCT HC/UH
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 4 1
Pbfree Code No
Rohs Code No
JESD-30 Code R-PDSO-G14
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Number of Terminals 14
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR
Packing Method TR
Prop. Delay@Nom-Sup 28 ns
Propagation Delay (tpd) 28 ns
Schmitt Trigger YES

Compare 5962-8683101CA with alternatives

Compare TC74HC132AFN-ELP with alternatives