5962-8683101CX vs 74HC132DR2G feature comparison

5962-8683101CX NXP Semiconductors

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74HC132DR2G Rochester Electronics LLC

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Source Content uid 5962-8683101CX
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Package Description DIP, SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 6 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
JESD-609 Code e3
Length 8.65 mm
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 190 ns
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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