5962-8683101CX vs GD74HCT132J feature comparison

5962-8683101CX Texas Instruments

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GD74HCT132J LG Semicon Co Ltd

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC LG SEMICON CO LTD
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Length 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 33 ns 38 ns
Propagation Delay (tpd) 30 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 4 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP14,.3
Terminal Finish Tin/Lead (Sn/Pb)

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