5962-8685601RA vs TC74HCT573P feature comparison

5962-8685601RA Texas Instruments

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TC74HCT573P Toshiba America Electronic Components

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Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code DIP DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-20 DIP,
Pin Count 20 20
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW/HIGH
Count Direction UNIDIRECTIONAL
Family HCT HCT
JESD-30 Code R-GDIP-T20 R-PDIP-T20
JESD-609 Code e0 e0
Length 24.195 mm 24.51 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Number of Bits 8 8
Number of Functions 8 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.16 mA
Prop. Delay@Nom-Sup 60 ns
Propagation Delay (tpd) 53 ns 44 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Additional Feature BROADSIDE VERSION OF 373

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