5962-8687303XX
vs
5962-8687303XC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
LOGIC DEVICES INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP64,.9
|
DIP, DIP64,.9
|
Pin Count |
64
|
64
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
|
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
|
Boundary Scan |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
R-CDIP-T64
|
R-CDIP-T64
|
JESD-609 Code |
e0
|
e4
|
Low Power Mode |
NO
|
NO
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Data Bus Width |
32
|
32
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP64,.9
|
DIP64,.9
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
38535Q/M;38534H;883B
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
GOLD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER
|
DSP PERIPHERAL, MULTIPLIER
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Clock Frequency-Max |
|
13.3 MHz
|
Length |
|
81.28 mm
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
225
|
Seated Height-Max |
|
3.81 mm
|
Supply Current-Max |
|
25 mA
|
Width |
|
22.86 mm
|
|
|
|
Compare 5962-8687303XX with alternatives
Compare 5962-8687303XC with alternatives