5962-8687303XX vs 5962-8687303XX feature comparison

5962-8687303XX Integrated Device Technology Inc

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5962-8687303XX LOGIC Devices Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC LOGIC DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP64,.9 DIP,
Pin Count 64 64
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED @ 13.33MHZ
Boundary Scan NO NO
External Data Bus Width 16 16
JESD-30 Code R-CDIP-T64 R-CDIP-T64
JESD-609 Code e0 e0
Low Power Mode NO NO
Number of Terminals 64 64
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Data Bus Width 32 32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP64,.9
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER DSP PERIPHERAL, MULTIPLIER
Base Number Matches 1 1
Length 81.28 mm
Seated Height-Max 4.826 mm
Width 22.86 mm

Compare 5962-8687303XX with alternatives

Compare 5962-8687303XX with alternatives