5962-8752101VA
vs
MM74C922MX
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP18,.3
|
SOP,
|
| Pin Count |
18
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CMOS
|
CMOS
|
| JESD-30 Code |
R-GDIP-T18
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
ENCODER
|
ENCODER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP18,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
210 ns
|
150 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
10 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
3
|
1
|
| Additional Feature |
|
16 KEY ENCODER
|
| Length |
|
12.8 mm
|
| Load Capacitance (CL) |
|
50 pF
|
|
|
|
Compare 5962-8752101VA with alternatives
Compare MM74C922MX with alternatives