5962-8754301CX vs 935189290112 feature comparison

5962-8754301CX AMD

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935189290112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, SSOP,
Pin Count 14 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family S HCT
JESD-30 Code R-GDIP-T14 R-PDSO-G16
Logic IC Type PARITY GENERATOR/CHECKER ADDER/SUBTRACTOR
Number of Bits 9 4
Number of Functions 1 1
Number of Terminals 14 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Power Supply Current-Max (ICC) 67 mA
Propagation Delay (tpd) 35 ns 80 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Length 6.2 mm
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2 mm
Technology CMOS
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 5.3 mm

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