5962-8768101EX
vs
5962-8768101EA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
VOLTAGE-MODE
|
CURRENT/VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
30 V
|
30 V
|
| Input Voltage-Min |
10 V
|
10 V
|
| Input Voltage-Nom |
15 V
|
15 V
|
| JESD-30 Code |
R-GDIP-T16
|
R-GDIP-T16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
2 A
|
2 A
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Base Number Matches |
4
|
4
|
| Package Equivalence Code |
|
DIP16,.3
|
| Screening Level |
|
MIL-STD-883
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare 5962-8768101EX with alternatives
Compare 5962-8768101EA with alternatives