5962-8780701RA
vs
MC54HC273AJ
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
DIP-20
|
DIP, DIP20,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-GDIP-T20
|
R-XDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
24.195 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
8
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
265 ns
|
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
|
| fmax-Min |
23 MHz
|
|
| Base Number Matches |
4
|
3
|
| Rohs Code |
|
No
|
| Load Capacitance (CL) |
|
50 pF
|
| Max Frequency@Nom-Sup |
|
8000000 Hz
|
| Max I(ol) |
|
0.0024 A
|
| Package Equivalence Code |
|
DIP20,.3
|
| Power Supplies |
|
2/6 V
|
|
|
|
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