5962-8858602XA
vs
5962-8858602XA
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
QIP
|
QIP
|
| Package Description |
DIP,
|
DIP,
|
| Pin Count |
78
|
78
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-XQIP-T78
|
S-XQIP-T78
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
78
|
78
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
6.35 mm
|
6.35 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5962-8858602XA with alternatives
Compare 5962-8858602XA with alternatives