5962-8858602XC
vs
5962-8858602XA
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
AEROFLEX PLAINVIEW
|
AEROFLEX COLORADO SPRINGS
|
Part Package Code |
QFP
|
QIP
|
Package Description |
DIP,
|
DIP,
|
Pin Count |
78
|
78
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-XQIP-T78
|
S-XQIP-T78
|
JESD-609 Code |
e4
|
e0
|
Number of Terminals |
78
|
78
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIP
|
DIP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
6.35 mm
|
6.35 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
GOLD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
Base Number Matches |
1
|
1
|
|
|
|