5962-8868907QA
vs
5962-8868908QA
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
ZILOG INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
CERAMIC, DIP-40
|
DIP,
|
Pin Count |
40
|
40
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
8 MHz
|
8 MHz
|
Communication Protocol |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
|
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC
|
Data Encoding/Decoding Method |
NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL (MANCHESTER)
|
NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL (MANCHESTER)
|
Data Transfer Rate-Max |
0.3125 MBps
|
12.5 MBps
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-GDIP-T40
|
R-GDIP-T40
|
JESD-609 Code |
e0
|
e0
|
Low Power Mode |
NO
|
NO
|
Number of Serial I/Os |
2
|
2
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP40,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
|
Supply Current-Max |
18 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
3
|
3
|
|
|
|
Compare 5962-8868907QA with alternatives
Compare 5962-8868908QA with alternatives