5962-8944902XX
vs
SPAK68882FN25A
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
MOTOROLA INC
|
Part Package Code |
QFP
|
|
Package Description |
QFF,
|
QCCJ,
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
5
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
12 MHz
|
25 MHz
|
External Data Bus Width |
16
|
32
|
JESD-30 Code |
S-CQFP-F68
|
S-PQCC-J68
|
Length |
24.08 mm
|
24.2062 mm
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QFF
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
2.69 mm
|
4.57 mm
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
FLAT
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.08 mm
|
24.2062 mm
|
uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
Base Number Matches |
1
|
2
|
Bus Compatibility |
|
MC68020; MC68030
|
|
|
|
Compare 5962-8944902XX with alternatives
Compare SPAK68882FN25A with alternatives