5962-89793012A
vs
5962H9658301QCA
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
QCCN,
|
DIP,
|
| Pin Count |
20
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ACT
|
ACT
|
| JESD-30 Code |
S-CQCC-N20
|
R-CDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.89 mm
|
19.43 mm
|
| Logic IC Type |
IDENTITY COMPARATOR
|
PARITY GENERATOR/CHECKER
|
| Number of Bits |
8
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Propagation Delay (tpd) |
12 ns
|
22 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-PRF-38535 Class Q
|
| Seated Height-Max |
1.905 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.89 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
ODD/EVEN PARITY GENERATOR
|
| Total Dose |
|
1M Rad(Si) V
|
|
|
|
Compare 5962-89793012A with alternatives
Compare 5962H9658301QCA with alternatives