5962-8983909RX vs 5962-8983912RA feature comparison

5962-8983909RX QP Semiconductor

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5962-8983912RA QP Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC QP SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 20 20
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-GDIP-T20 R-GDIP-T20
Number of Dedicated Inputs 8 8
Number of I/O Lines 8 8
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type FLASH PLD EE PLD
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
JESD-609 Code e0
Propagation Delay 25 ns
Screening Level MIL-STD-883
Terminal Finish TIN LEAD

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