5962-8983909RX vs PALCE16V8Q-25PI/4 feature comparison

5962-8983909RX QP Semiconductor

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PALCE16V8Q-25PI/4 Lattice Semiconductor Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC LATTICE SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-20
Pin Count 20 20
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-GDIP-T20 R-PDIP-T20
Number of Dedicated Inputs 8 8
Number of I/O Lines 8 8
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 8 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 8 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type FLASH PLD EE PLD
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Architecture PAL-TYPE
Clock Frequency-Max 37 MHz
JESD-609 Code e0
Length 26.1366 mm
Number of Inputs 18
Number of Outputs 8
Number of Product Terms 64
Package Equivalence Code DIP20,.3
Peak Reflow Temperature (Cel) 225
Propagation Delay 25 ns
Seated Height-Max 4.953 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

Compare 5962-8983909RX with alternatives

Compare PALCE16V8Q-25PI/4 with alternatives