5962-8984101LA
vs
5962-8984107LA
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
CERAMIC, DIP-24
|
CERAMIC, DIP-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT ALSO AVAILABLE IN GDIP-24 PACKAGE
|
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
22 MHz
|
30.3 MHz
|
| JESD-30 Code |
R-CDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Number of Dedicated Inputs |
11
|
11
|
| Number of I/O Lines |
10
|
10
|
| Number of Inputs |
22
|
22
|
| Number of Outputs |
10
|
10
|
| Number of Product Terms |
132
|
132
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
11 DEDICATED INPUTS, 10 I/O
|
11 DEDICATED INPUTS, 10 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Programmable Logic Type |
EE PLD
|
FLASH PLD
|
| Propagation Delay |
30 ns
|
25 ns
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535; MIL-STD-883
|
MIL-STD-883
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
7
|
3
|
| Rohs Code |
|
No
|
|
|
|
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