5962-8984101LX vs 5962-89841013A feature comparison

5962-8984101LX NXP Semiconductors

Buy Now

5962-89841013A AMD

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ADVANCED MICRO DEVICES INC
Part Package Code DIP QLCC
Package Description DIP, QCCN,
Pin Count 24 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 22 MHz 25 MHz
JESD-30 Code R-GDIP-T24 S-CQCC-N28
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Terminals 24 28
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Programmable Logic Type EE PLD EE PLD
Propagation Delay 30 ns 30 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL QUAD
Base Number Matches 6 6
Factory Lead Time 4 Weeks
Additional Feature VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
JESD-609 Code e0
Length 11.43 mm
Seated Height-Max 2.54 mm
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 11.43 mm

Compare 5962-8984101LX with alternatives

Compare 5962-89841013A with alternatives