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5962-8984502CX vs 74HC132D feature comparison

5962-8984502CX Defense Logistics Agency

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74HC132D Toshiba America Electronic Components

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Part Life Cycle Code Active Active
Ihs Manufacturer DEFENSE LOGISTICS AGENCY TOSHIBA CORP
Part Package Code DIP
Package Description CERAMIC, DIP-14 SOP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 186 ns 140 ns
Qualification Status Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 4
Rohs Code Yes
Factory Lead Time 12 Weeks
Length 8.65 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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