5962-8984502CX vs 74HC132N feature comparison

5962-8984502CX Defense Logistics Agency

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74HC132N NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 186 ns 38 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 2
Source Content uid 74HC132N
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
JESD-609 Code e4
Length 19.025 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 31 ns
Schmitt Trigger YES
Seated Height-Max 4.2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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