5962-8984502CX vs TC74HC132AFN-ELP feature comparison

5962-8984502CX Defense Supply Center Columbus

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TC74HC132AFN-ELP Toshiba America Electronic Components

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Part Life Cycle Code Active Obsolete
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 186 ns 28 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 1
Source Content uid TC74HC132AFN-ELP
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 240
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 28 ns
Schmitt Trigger YES
Seated Height-Max 1.75 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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Compare TC74HC132AFN-ELP with alternatives

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