5962-9088202MPX vs TS922AIN feature comparison

5962-9088202MPX Texas Instruments

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TS922AIN STMicroelectronics

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.0005 µA 0.1 µA
Bias Current-Max (IIB) @25C 0.0005 µA 0.1 µA
Common-mode Reject Ratio-Min 75 dB
Common-mode Reject Ratio-Nom 115 dB 80 dB
Frequency Compensation YES YES
Input Offset Current-Max (IIO) 0.00075 µA
Input Offset Voltage-Max 1250 µV 1800 µV
JESD-30 Code R-GDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Length 9.6 mm
Low-Bias YES NO
Low-Offset NO NO
Micropower NO NO
Neg Supply Voltage Limit-Max -8 V
Neg Supply Voltage-Nom (Vsup) -5 V
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power NO NO
Programmable Power NO NO
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 4.8 mm
Slew Rate-Min 0.9 V/us 0.7 V/us
Slew Rate-Nom 2.7 V/us 1.3 V/us
Supply Current-Max 2.5 mA 3 mA
Supply Voltage Limit-Max 8 V 14 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO NO
Technology CMOS BICMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 1900 4000
Voltage Gain-Min 25000 15000
Wideband NO NO
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer STMicroelectronics
Packing Method TUBE

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