5962-9099401MPA
vs
LMH6609MA/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP8,.3
|
SOIC-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
CURRENT-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
22 µA
|
5 µA
|
| Frequency Compensation |
YES (AVCL>=2)
|
YES
|
| Input Offset Voltage-Max |
10000 µV
|
2500 µV
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Low-Offset |
NO
|
NO
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-6.6 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-3.3 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
1.753 mm
|
| Slew Rate-Min |
2000 V/us
|
1200 V/us
|
| Supply Current-Max |
12 mA
|
8.5 mA
|
| Supply Voltage Limit-Max |
7 V
|
6.6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Wideband |
YES
|
YES
|
| Width |
7.62 mm
|
3.899 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Average Bias Current-Max (IIB) |
|
3 µA
|
| Common-mode Reject Ratio-Nom |
|
75 dB
|
| Length |
|
4.902 mm
|
| Low-Bias |
|
NO
|
| Micropower |
|
NO
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Slew Rate-Nom |
|
800 V/us
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Unity Gain BW-Nom |
|
180000
|
|
|
|
Compare 5962-9099401MPA with alternatives
Compare LMH6609MA/NOPB with alternatives