5962-9558201QFA
vs
MC74LVQ138M
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
LANSDALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP, FL16,.3
|
SOP, SOP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
USABLE AS 1 TO 8 DEMULTIPLEXER
|
3 ENABLE INPUTS
|
| Family |
TTL/H/L
|
LVQ
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-CDFP-F16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
2-LINE TO 4-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Max I(ol) |
0.016 A
|
0.012 A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
SOP
|
| Package Equivalence Code |
FL16,.3
|
SOP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
35 mA
|
|
| Prop. Delay@Nom-Sup |
30 ns
|
15 ns
|
| Propagation Delay (tpd) |
32 ns
|
20 ns
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class Q
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Length |
|
10.2 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Seated Height-Max |
|
2.05 mm
|
| Width |
|
5.275 mm
|
|
|
|
Compare 5962-9558201QFA with alternatives
Compare MC74LVQ138M with alternatives