5962-9560301QPA
vs
OPA2336UA/2K5
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS INC
|
| Package Description |
DIP, DIP8,.3
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.000025 µA
|
0.00006 µA
|
| Bias Current-Max (IIB) @25C |
0.000025 µA
|
|
| Common-mode Reject Ratio-Nom |
70 dB
|
86 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
500 µV
|
500 µV
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
MIL-PRF-38535 Class Q
|
|
| Seated Height-Max |
5.08 mm
|
1.75 mm
|
| Slew Rate-Min |
0.007 V/us
|
|
| Slew Rate-Nom |
0.023 V/us
|
0.03 V/us
|
| Supply Current-Max |
0.07 mA
|
|
| Supply Voltage Limit-Max |
16 V
|
7.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
60
|
100
|
| Voltage Gain-Min |
1000
|
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Length |
|
4.9 mm
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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