5962-9755701HPX vs HCPL-7851#300 feature comparison

5962-9755701HPX Agilent Technologies Inc

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HCPL-7851#300 Agilent Technologies Inc

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer AGILENT TECHNOLOGIES INC AGILENT TECHNOLOGIES INC
Part Package Code DIP SOIC
Package Description DIP, SOP, GWDIP8,.4
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 100 MHz 100 MHz
Common Mode Voltage-Max 2.8 V 2.8 V
JESD-30 Code R-CDIP-T8 R-CDSO-G8
Length 9.655 mm 9.655 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 5.57 mm
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Voltage Gain-Max 8.4 8.4
Voltage Gain-Min 7.6 7.6
Width 7.62 mm 7.366 mm
Base Number Matches 4 3
Rohs Code No
JESD-609 Code e0
Package Equivalence Code GWDIP8,.4
Screening Level 38535Q/M;38534H;883B
Technology HYBRID
Terminal Finish TIN LEAD

Compare 5962-9755701HPX with alternatives

Compare HCPL-7851#300 with alternatives