5962-9755701HXX
vs
HCPL-7825
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
BROADCOM INC
|
HEWLETT PACKARD CO
|
| Package Description |
SOP,
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
100 MHz
|
200 MHz
|
| Common Mode Voltage-Max |
2.8 V
|
3750 V
|
| JESD-30 Code |
R-CDSO-G8
|
R-PDIP-T8
|
| Length |
9.655 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
100 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.57 mm
|
|
| Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Voltage Gain-Max |
8.4
|
8.56
|
| Voltage Gain-Min |
7.6
|
7.44
|
| Width |
7.366 mm
|
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| Isolation Voltage-Min |
|
3750 V
|
| Technology |
|
CMOS
|
|
|
|
Compare 5962-9755701HXX with alternatives
Compare HCPL-7825 with alternatives