5962-9755701HYA vs HCPL-7851#300 feature comparison

5962-9755701HYA Hewlett Packard Co

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HCPL-7851#300 Agilent Technologies Inc

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HEWLETT PACKARD CO AGILENT TECHNOLOGIES INC
Part Package Code DIP SOIC
Package Description , SOP, GWDIP8,.4
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 100 MHz 100 MHz
JESD-30 Code R-PDIP-T8 R-CDSO-G8
JESD-609 Code e0 e0
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Voltage Gain-Max 8.4 8.4
Voltage Gain-Min 7.6 7.6
Base Number Matches 4 3
Rohs Code No
Common Mode Voltage-Max 2.8 V
Length 9.655 mm
Package Code SOP
Package Equivalence Code GWDIP8,.4
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.57 mm
Technology HYBRID
Terminal Pitch 2.54 mm
Width 7.366 mm

Compare 5962-9755701HYA with alternatives

Compare HCPL-7851#300 with alternatives