5962G9651503VXX
vs
933372920652
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DFP
|
SOIC
|
| Package Description |
DFP,
|
PLASTIC, SOT-109-1, SO-16
|
| Pin Count |
14
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ACT
|
4000/14000/40000
|
| JESD-30 Code |
R-CDFP-F14
|
R-PDSO-G16
|
| Length |
8.626 mm
|
9.9 mm
|
| Logic IC Type |
NOR GATE
|
INVERTER
|
| Number of Functions |
4
|
6
|
| Number of Inputs |
2
|
1
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
17 ns
|
100 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
|
| Seated Height-Max |
2.575 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
500k Rad(Si) V
|
|
| Width |
6.475 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 5962G9651503VXX with alternatives
Compare 933372920652 with alternatives