5962R9662201VCX vs CD4013BMN feature comparison

5962R9662201VCX Harris Semiconductor

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CD4013BMN National Semiconductor Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NATIONAL SEMICONDUCTOR CORP
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 405 ns 350 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 2.59 MHz 2.5 MHz
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Length 19.18 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 5000000 Hz
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 350 ns
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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