5AGXFB3H4F35I3
vs
5AGXFB3H4F35I3G
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
BGA,
|
FBGA-1152
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Additional Feature |
CAN ALSO OPERATES AT 1.1 V AND 1.15 V NOMINAL SUPPLY
|
|
| Clock Frequency-Max |
650 MHz
|
|
| JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
| JESD-609 Code |
e0
|
|
| Length |
35 mm
|
35 mm
|
| Number of CLBs |
362000
|
13688
|
| Number of Terminals |
1152
|
1152
|
| Organization |
362000 CLBS
|
13688 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
2.7 mm
|
2.7 mm
|
| Supply Voltage-Nom |
0.85 V
|
1.15 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
4
|
1
|
| Number of Inputs |
|
704
|
| Number of Logic Cells |
|
362000
|
| Number of Outputs |
|
704
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
BGA1152,34X34,40
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Voltage-Max |
|
1.18 V
|
| Supply Voltage-Min |
|
1.12 V
|
| Technology |
|
TSMC
|
| Temperature Grade |
|
INDUSTRIAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 5AGXFB3H4F35I3 with alternatives
Compare 5AGXFB3H4F35I3G with alternatives