5AGXFB3H4F35I3
vs
5AGXFB3H4F35I3P
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
BGA,
|
FBGA-1152
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Additional Feature |
CAN ALSO OPERATES AT 1.1 V AND 1.15 V NOMINAL SUPPLY
|
|
Clock Frequency-Max |
650 MHz
|
|
JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
JESD-609 Code |
e0
|
|
Length |
35 mm
|
35 mm
|
Number of CLBs |
362000
|
13688
|
Number of Inputs |
544
|
704
|
Number of Outputs |
544
|
704
|
Number of Terminals |
1152
|
1152
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
13688 CLBS
|
13688 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
HBGA
|
Package Equivalence Code |
BGA1152,34X34,40
|
BGA1152,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
2.7 mm
|
2.7 mm
|
Supply Voltage-Max |
1.18 V
|
1.18 V
|
Supply Voltage-Min |
1.12 V
|
1.12 V
|
Supply Voltage-Nom |
1.15 V
|
1.15 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
4
|
1
|
Number of Logic Cells |
|
362000
|
Technology |
|
TSMC
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare 5AGXFB3H4F35I3 with alternatives
Compare 5AGXFB3H4F35I3P with alternatives