5AGXFB3H4F35I3 vs 5AGXFB3H4F35I3P feature comparison

5AGXFB3H4F35I3 Intel Corporation

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5AGXFB3H4F35I3P Intel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description BGA, FBGA-1152
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Additional Feature CAN ALSO OPERATES AT 1.1 V AND 1.15 V NOMINAL SUPPLY
Clock Frequency-Max 650 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0
Length 35 mm 35 mm
Number of CLBs 362000 13688
Number of Inputs 544 704
Number of Outputs 544 704
Number of Terminals 1152 1152
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 13688 CLBS 13688 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.7 mm 2.7 mm
Supply Voltage-Max 1.18 V 1.18 V
Supply Voltage-Min 1.12 V 1.12 V
Supply Voltage-Nom 1.15 V 1.15 V
Surface Mount YES YES
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 4 1
Number of Logic Cells 362000
Technology TSMC
Temperature Grade INDUSTRIAL

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