5AGXMA5D4F27C4N
vs
5AGXMA5D4F27C4P
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
FBGA-672
|
FBGA-672
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B672
|
JESD-609 Code |
e1
|
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
7170
|
7170
|
Number of Inputs |
544
|
544
|
Number of Logic Cells |
190000
|
190000
|
Number of Outputs |
544
|
544
|
Number of Terminals |
672
|
672
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
7170 CLBS
|
7170 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
HBGA
|
Package Equivalence Code |
BGA672,26X26,40
|
BGA672,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.7 mm
|
2.7 mm
|
Supply Voltage-Max |
1.13 V
|
1.13 V
|
Supply Voltage-Min |
1.07 V
|
1.07 V
|
Supply Voltage-Nom |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
1
|
Technology |
|
TSMC
|
|
|
|
Compare 5AGXMA5D4F27C4N with alternatives
Compare 5AGXMA5D4F27C4P with alternatives