5AGZME5H2F35C3NCV vs 5AGZME5H2F35C3N feature comparison

5AGZME5H2F35C3NCV Intel Corporation

Buy Now Datasheet

5AGZME5H2F35C3N Intel Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-1152 35 MM, LEAD FREE, FBGA-1152
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
Length 35 mm 35 mm
Number of CLBs 15096 400000
Number of Inputs 534 534
Number of Logic Cells 400000 400000
Number of Outputs 534 534
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 15096 CLBS 400000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.7 mm 3.6 mm
Supply Voltage-Max 0.88 V 0.88 V
Supply Voltage-Min 0.82 V 0.82 V
Supply Voltage-Nom 0.85 V 0.85 V
Surface Mount YES YES
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 2
ECCN Code 3A991
Samacsys Manufacturer Intel
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 5AGZME5H2F35C3NCV with alternatives

Compare 5AGZME5H2F35C3N with alternatives