5AGZME5H2F35I3N
vs
5AGZME5H2F35I3
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
ROHS COMPLIANT, FBGA-1152
|
FBGA-1152
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
JESD-609 Code |
e1
|
e0
|
Length |
35 mm
|
35 mm
|
Number of CLBs |
15096
|
|
Number of Inputs |
674
|
|
Number of Logic Cells |
400000
|
|
Number of Outputs |
674
|
|
Number of Terminals |
1152
|
1152
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
15096 CLBS
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1152,34X34,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
3.5 mm
|
2.7 mm
|
Supply Voltage-Max |
1.18 V
|
1.18 V
|
Supply Voltage-Min |
1.12 V
|
1.12 V
|
Supply Voltage-Nom |
1.15 V
|
1.15 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
2
|
2
|
Clock Frequency-Max |
|
670 MHz
|
|
|
|
Compare 5AGZME5H2F35I3N with alternatives
Compare 5AGZME5H2F35I3 with alternatives