5M2210ZF256C4N
vs
5M2210ZF256I5
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
|
17 X 17 MM, 1 MM PITCH, FBGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991
|
3A991
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Additional Feature |
YES
|
YES
|
| Clock Frequency-Max |
247.5 MHz
|
201.1 MHz
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e0
|
| JTAG BST |
YES
|
YES
|
| Length |
17 mm
|
17 mm
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
203
|
203
|
| Number of Inputs |
203
|
203
|
| Number of Macro Cells |
1700
|
1700
|
| Number of Outputs |
203
|
203
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
203 I/O
|
203 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
| Propagation Delay |
9.1 ns
|
11.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.55 mm
|
1.55 mm
|
| Supply Voltage-Max |
1.89 V
|
1.89 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare 5M2210ZF256C4N with alternatives
Compare 5M2210ZF256I5 with alternatives