5M570ZM100I5
vs
5M570ZT100I5
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
6 X 6 MM, 0.50 MM PITCH, MBGA-100
|
16 X 16 MM, 0.50 MM PITCH, TQFP-100
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
YES
|
|
| Clock Frequency-Max |
118.3 MHz
|
118.3 MHz
|
| In-System Programmable |
YES
|
|
| JESD-30 Code |
S-PBGA-B100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
e0
|
| JTAG BST |
YES
|
|
| Length |
6 mm
|
14 mm
|
| Number of I/O Lines |
74
|
74
|
| Number of Macro Cells |
440
|
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
74 I/O
|
74 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFQFP
|
| Package Equivalence Code |
BGA100,11X11,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
| Propagation Delay |
17.7 ns
|
17.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.89 V
|
1.89 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
6 mm
|
14 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare 5M570ZM100I5 with alternatives
Compare 5M570ZT100I5 with alternatives