5SGXMABN3F45I3G vs 5SGXMABN3F45I3N feature comparison

5SGXMABN3F45I3G Intel Corporation

Buy Now Datasheet

5SGXMABN3F45I3N Intel Corporation

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description , FBGA-1932
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1
Rohs Code Yes
JESD-30 Code S-PBGA-B1932
Length 45 mm
Number of CLBs 35920
Number of Inputs 840
Number of Logic Cells 952000
Number of Outputs 840
Number of Terminals 1932
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 35920 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.9 mm
Supply Voltage-Max 0.88 V
Supply Voltage-Min 0.82 V
Supply Voltage-Nom 0.85 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm

Compare 5SGXMABN3F45I3G with alternatives

Compare 5SGXMABN3F45I3N with alternatives