5SGXMABN3F45I3G
vs
5SGXMABN3F45I3N
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
,
|
FBGA-1932
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
JESD-30 Code |
|
S-PBGA-B1932
|
Length |
|
45 mm
|
Number of CLBs |
|
35920
|
Number of Inputs |
|
840
|
Number of Logic Cells |
|
952000
|
Number of Outputs |
|
840
|
Number of Terminals |
|
1932
|
Operating Temperature-Max |
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
35920 CLBS
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA1932,44X44,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
3.9 mm
|
Supply Voltage-Max |
|
0.88 V
|
Supply Voltage-Min |
|
0.82 V
|
Supply Voltage-Nom |
|
0.85 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
45 mm
|
|
|
|
Compare 5SGXMABN3F45I3G with alternatives
Compare 5SGXMABN3F45I3N with alternatives