6N137
vs
HCPL-5630#200
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ISOCOM LTD
|
HEWLETT PACKARD CO
|
Package Description |
DIP-8
|
HERMETIC SEALED, DIP-8
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8541.40.80.00
|
8541.40.80.00
|
Additional Feature |
UL APPROVED
|
OPEN COLLECTOR, TTL COMPATIBLE, HIGH RELIABILITY
|
Configuration |
SINGLE
|
1SEC2
|
Data Rate-Nom |
10 MBps
|
10 MBps
|
Forward Current-Max |
0.05 A
|
0.02 A
|
Isolation Voltage-Max |
5000 V
|
1500 V
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Number of Elements |
1
|
2
|
Number of Functions |
1
|
2
|
On-State Current-Max |
0.05 A
|
0.025 A
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
Packing Method |
TUBE
|
|
Response Time-Nom |
4e-8 ns
|
3.5e-8 ns
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Surface Mount |
NO
|
NO
|
Base Number Matches |
8
|
1
|
ECCN Code |
|
3A001.A.2.C
|
Hysteresis Ratio-Nom |
|
0.0125
|
JESD-609 Code |
|
e0
|
Power Dissipation-Max |
|
0.04 W
|
Supply Voltage-Nom |
|
5.5 V
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare 6N137 with alternatives
Compare HCPL-5630#200 with alternatives