71V67803166BGG vs IS61SF25632T-8TQ feature comparison

71V67803166BGG Integrated Device Technology Inc

Buy Now Datasheet

IS61SF25632T-8TQ Integrated Silicon Solution Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA QFP
Package Description BGA, TQFP-100
Pin Count 119 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 8 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PQFP-G100
JESD-609 Code e1 e0
Length 22 mm 20 mm
Memory Density 9437184 bit 8388608 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 18 32
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX18 256KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.36 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.465 V 3.63 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63X.87
Standby Current-Max 0.03 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.4 mA

Compare 71V67803166BGG with alternatives

Compare IS61SF25632T-8TQ with alternatives