741X083102JP
vs
741X083102J
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
CTS CORP
|
CTS CORP
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.20
|
8533.21.00.20
|
| Factory Lead Time |
27 Weeks
|
|
| Samacsys Manufacturer |
CTS
|
|
| Construction |
Rectangular
|
Chip
|
| Element Power Dissipation |
0.063 W
|
0.063 W
|
| First Element Resistance |
1000 Ω
|
1000 Ω
|
| JESD-609 Code |
e3
|
e0
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Network Type |
ISOLATED
|
ISOLATED
|
| Number of Elements |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.4 mm
|
0.35 mm
|
| Package Length |
2 mm
|
2 mm
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1 mm
|
1 mm
|
| Packing Method |
TR, PAPER, 7 INCH
|
TR, PAPER, 7 INCH
|
| Rated Power Dissipation (P) |
0.252 W
|
0.252 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Reference Standard |
AEC-Q200
|
|
| Resistance |
1000 Ω
|
1000 Ω
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Second/Last Element Resistance |
1000 Ω
|
|
| Size Code |
0408
|
0408
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
25 V
|
25 V
|
| Base Number Matches |
1
|
2
|
| Manufacturer Series |
|
741
|
| Series |
|
741X083(GJ TOL)
|
|
|
|
Compare 741X083102JP with alternatives
Compare 741X083102J with alternatives